Oita Virtual International Trade Show

Company Name: Psi Technologies, Inc. Philippines

Type of Business: Manufacturing
Type of Products: Assembly and testing of semiconductor devices




Exhibition Product A TO 220 Full Pack (Isolated TO-220)
TO 220 Full Pack (Isolated TO-220)
TO 220 Full Pack (Isolated TO-220)
Material(s) Terms of Payment
Dual-gauge Cu leadframe with Ni stripe, 95Pb/5Sn solder, Al wire, ECN molding compound L/C
Variations
Cu leadframe with Ag stripe for Au wire bonding
Conditions of Price
Ex Factory
Minimum Quantity
200K/Week
Maximum Quantity
By Negotiation
Selling Point(s)
  1. The PSi TO-220 Full Pack package is ideal at providing electrical isolation since the heatsink is fully capsulated with plastic
  2. This isolation is equivalent to using a 100-mocron mica barrier with a standard TO-220
  3. There is no extra hardware needed to provide electrical isolation between the device and the heatsink. Thus, this makes it easier to use and assemble relative to a standard TO-220
  4. Provides isolation of up to 5KV and is ideal for various motor drive and power supply applications
  5. The copper leadframe has a die pad of 7.34mm x 6.60mm





Exhibition Product B Plastic Flange Mount (PowerFlex(R))
Plastic Flange Mount (PowerFlex(R))
Plastic Flange Mount (PowerFlex(R))
Material(s) Terms of Payment
Cu leadframe with Ag stripe, epoxy solder, Au wire, ECN molding compound L/C
Conditions of Price
Ex Factory
Minimum Quantity
200K/Week
Maximum Quantity
By negotiation
Selling Point(s)
  1. PSi Technologies' PowerFlex(R) package offers customers thin, surface mountable and thermally-enhanced power packages compatible with much of the existing assembly equipment in use for production and mounting of DPak,DDPak and TO-220
  2. Low profile to help reduce the total system size and cost while retaining most of the power dissipation characteristics of their large form factor package counterpart
  3. Often used in medium power applications, such as voltage regulators
  4. Can accommodate die size of up to 4.45mm x 4.45mm





Exhibition Product C TO-247
TO-247
TO-247
Material(s) Terms of Payment
Dual-gauge Cu Ni preplated leadframe, 95Pb/5Sn solder, Al wire, ECN molding compound L/C
Conditions of Price Availability of Samples
Ex Factory Can Send (No Charge)
Minimum Quantity Availability of Catalogues
200K/Week Can Send (No Charge)
Maximum Quantity
By negotiation
Selling Point(s)
  1. Due to it's excellent power dissipation characteristic, TO-247 is ideal for Power MOSFET's, high power bipolar transistors and IGBTs
  2. PSi has developed "dual die / dual dispensing" capability for this package using a full auto die bonder on a soft solder die attachment process
  3. TO-247 can accommodate a die size up to 11.4mm x 6.6mm and has a package width, length and thickness of 20.9mm, 15.9mm and 5.03mm, respectively
  4. TO-247 has a leadpost dimension that is capable of accommodating 0.102mm x 0.38mm wire



Business Profile

PSi Technologies, Inc. was first established in February 1988. A subsidiary of RFM Corporation, PSi Technologies, Inc. is engaged in high-volume contract assembly and final testing of various power packages for the semiconductor industry. It provides "Total Solutions" through it's advanced technology by developing power packages that match the customers' die technology and specific application requirements.

PSi Technologies, Inc. offers a wide spectrum of power packages from 2 leads to 15 leads, in surface mount or through-hole versions. Packaging and testing capabilities compliment packages used in different applications such as power MOSFETs - both high, medium and low power, voltage regulators, transient suppressors, rectifiers, thyristors (SCRs and TRIACs,) bipolar transistors and IGBTs. A reflection that PSi is one of the dominant players in contract assembly and testing of power semiconductors.

PSi Technologies, Inc. is also certified to produce time-proven packages such as metal cans, cerdips, cerpacks, ceramic leadless chip carriers and flatpacks which are actively used for military and automotive applications.

PSi continues to provide sustaining support to non-power packages and other strategic business to strengthen long, established partnerships with our customers. This is part of PSi's customer driven strategy to sustain it's current businesses as well as continue exploring other opportunities.

An added advantage is the strength of PSi Technologies, Inc. shareholders. They include one of the Philippines' largest conglomerates, RFM Corporation as well as the international investment firms, Nomura/Jafco Investments Ltd. and Merill Lynch Direct Investments.



Business Summary
Year Established 1988
Capital PHP 286,000,000
Annual Sales USD 36,000,000 (1998)
Number of Employees 3,200
Number of Factories 2
Name of Bank Citibank
Company President(CEO) Mr. Arthur J. Young, Jr.

Contact Details
Project Manager Mena V. Villena
Communicate in Japanese No
Address Electronics Avenue, FTI Complex, Taguig Metro MLA, PHILIPPINES
Telephone Number +632-838-49-66 ~ 74 (ext. 143/127)
+632-838-46-94/88 (direct)
FAX Number +632-838-46-48
E-mail Addresses mktg@psitechnologies.com
mvvillena@psitechnologies.com.ph
Web-site Address http://www.psitechnologies.com

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